IP Library Assignment 017587/0903
Patent Assignment
Reel/Frame 017587/0903

Assignment of Assignor's Interest

Recorded: 2006-05-08 Pages: 4
Assignors
KUECHENMEISTER, FRANK
Executed: 2005-08-26
PLATZ, ALEXANDER
Executed: 2005-08-29
JUNGNICKEL, GOTTHARD
Executed: 2005-08-26
SIURY, KERSTIN
Executed: 2005-08-26
Assignee
ADVANCED MICRO DEVICES, INC.
5204 EAST BEN WHITE BOULEVARD, AUSTIN, TEXAS, 78741
Covered Property (1)
Technique for Efficiently Patterning an Underbump Metallization Layer Using a Dry Etch Process
Patent: 7,585,759 →
Application: 11/382,135 →
Publication: US 2007/0023928
Related Assignments (5)
Other recorded transfers of the patent in this record — the chain of ownership.
Affirmation of Patent Assignment Aug 18, 2009
From: ADVANCED MICRO DEVICES, INC.
To: GLOBALFOUNDRIES INC.
Reel/Frame 023120/0426 →
Security Agreement Nov 29, 2018
From: GLOBALFOUNDRIES INC.
To: WILMINGTON TRUST, NATIONAL ASSOCIATION
Reel/Frame 049490/0001 →
Release of Security Interest Nov 19, 2020
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES INC.
Reel/Frame 054479/0842 →
Assignment of Assignor's Interest Nov 19, 2020
From: GLOBALFOUNDRIES INC.
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 054482/0862 →
Release of Security Interest Nov 20, 2020
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES INC.
Reel/Frame 054636/0001 →