Patent Assignment
Reel/Frame 017702/0703
Assignment of Assignor's Interest
Recorded: 2005-11-07
Pages: 4
Assignors
PAULEY, ROBERT S.
Executed: 2005-04-29
BHAKTA, JAYESH R.
Executed: 2005-04-22
GERVASI, WILLIAM M.
Executed: 2005-04-29
CHEN, CHI SHE
Executed: 2005-08-22
Assignee
NETLIST, INC.
475 GODDARD, SUITE 100, IRVINE, CALIFORNIA, 92618
Covered Property
(1)
High Density Memory Module Using Stacked Printed Circuit Boards
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
Jul 18, 2013
From: NETLIST, INC.
To: DBD CREDIT FUNDING LLC
Reel/Frame 030830/0945 →
Security Interest
Nov 20, 2015
From: NETLIST, INC.
To: SVIC NO. 28 NEW TECHNOLOGY BUSINESS INVESTMENT L.L.P.
Reel/Frame 037150/0897 →
Termination of Intellectual Property Security Agreement
Dec 3, 2015
From: DBD CREDIT FUNDING LLC
To: NETLIST, INC.
Reel/Frame 037209/0158 →
Release of Security Interest
Nov 20, 2023
From: SVIC. NO. 28 NEW TECHNOLOGY BUSINESS INVESTMENT L.L.P.
To: NETLIST, INC
Reel/Frame 065629/0328 →