Patent Assignment
Reel/Frame 030830/0945
Security Agreement
Recorded: 2013-07-18
Pages: 14
Assignor
NETLIST, INC.
Executed: 2013-07-18
Assignee
DBD CREDIT FUNDING LLC
1345 AVENUE OF THE AMERICAS, 46TH FLOOR, NEW YORK, NEW YORK, 10105
Covered Properties
(48)
Module Having at Least One Thermally Conductive Layer Between Printed Circuit Boards
Patent:
8,971,045 →
Application:
13/731,014 →
Multi-Rank Memory Module
Application:
61/682,249 →
Circuit Providing Load Isolation and Noise Reduction
Apparatus and Method for Self-Test in a Multi-Rank Memory Module
Patent:
8,689,064 →
Application:
13/745,790 →
Circuit and Method for Refreshing a Memory Module
Patent:
8,599,634 →
Application:
13/584,679 →
Method and Apparatus for Optimizing Driver Load in a Memory Package
Method and System for Resolving Interoperability of Multiple Types of Dual in-Line Memory Modules
Application:
13/411,344 →
Publication:
US US20120239874A1
Memory Module with Distributed Data Buffers and Method of Operation
Application:
61/676,883 →
Circuit for Memory Module
Patent:
8,516,188 →
Application:
13/287,081 →
System and Method of Increasing Addressable Memory Space on a Memory Board
Multirank Ddr Memory Modual with Load Reduction
Patent:
8,756,364 →
Application:
13/287,042 →
System and Method Utilizing Distributed Byte-Wise Buffers on a Memory Module
Heat Dissipation for Electronic Modules
Patent:
8,705,239 →
Application:
13/205,477 →
Electronic Module with Flexible Portion
Patent:
8,864,500 →
Application:
13/653,254 →
Arrangement of Integrated Ciruits in a Memory Module
Arrangement of Integrated Circuits in a Memory Module
Arrangement of Integrated Circuits in a Memory Module
Arrangement of Integrated Circuits in a Memory Module
High Density Memory Module Using Stacked Printed Circuit Boards
High Density Memory Module Using Stacked Printed Circuit Boards
Circuit Card with Flexible Connection for Memory Module with Heat Spreader
Patent:
7,442,050 →
Application:
11/511,523 →
High Density Module Having at Least Two Substrates and at Least One Thermally Conductive Layer Therebetween
Circuit with Flexible Portion
Patent:
7,811,097 →
Application:
12/237,162 →
Module Having at Least Two Surfaces and at Least One Thermally Conductive Layer Therebetween
Circuit with Flexible Portion
Patent:
8,033,836 →
Application:
12/874,900 →
Circuit with Flexible Portion
Patent:
8,287,291 →
Application:
13/231,870 →
Module Having at Least Two Surfaces and at Least One Thermally Conductive Layer Therebetween
Memory Board with Self-Testing Capability
Patent:
8,001,434 →
Application:
12/422,925 →
Circuit Providing Load Isolation and Noise Reduction
Patent:
8,154,901 →
Application:
12/422,853 →
Systems and Methods for Refreshing a Memory Module
Patent:
8,264,903 →
Application:
12/774,632 →
Memory Board with Self-Testing Capability
Patent:
8,359,501 →
Application:
13/183,253 →
Systems and Methods for Handshaking with a Memory Module
Patent:
8,489,837 →
Application:
12/815,339 →
High-Density Memory Module Utilizing Low-Density Memory Components
Memory Module Decoder
Memory Module with a Circuit Providing Load Isolation and Memory Domain Translation
Memory Module Decoder
Memory Module with a Circuit Providing Load Isolation and Memory Domain Translation
Memory Module Decoder
Circuit Providing Load Isolation and Memory Domain Translation for Memory Module
Circuit Providing Load Isolation and Memory Domain Translation for Memory Module
Circuit Providing Load Isolation and Memory Domain Translation for Memory Module
Patent:
8,072,837 →
Application:
12/981,380 →
Circuit for Providing Chip-Select Signals to a Plurality of Ranks of a Ddr Memory Module
Circuit for Providing Chip-Select Signals to a Plurality of Ranks of a Ddr Memory Module
Patent:
8,081,537 →
Application:
13/154,172 →
Circuit for Memory Module
Patent:
8,081,536 →
Application:
13/032,470 →
Heat Spreader for Electronic Modules
Patent:
7,619,893 →
Application:
11/707,625 →
Heat Spreader for Memory Modules
Patent:
7,839,643 →
Application:
12/617,665 →
Heat Dissipation for Electronic Modules
Patent:
8,018,723 →
Application:
12/432,591 →
Memory Module Having Thermal Conduits
Patent:
8,488,325 →
Application:
12/916,945 →
Related Assignments
(10)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 7, 2005
From: PAULEY, ROBERT S.; BHAKTA, JAYESH R.; GERVASI, WILLIAM M.; CHEN, CHI SHE
To: NETLIST, INC.
Reel/Frame 017702/0703 →
Assignment of Assignor's Interest
Jun 1, 2007
From: BHAKTA, JAYESH R.; YU, ENCHAO; CHEN, CHI SHE; FLAIG, RICHARD E.
To: NETLIST, INC.
Reel/Frame 019374/0047 →
Assignment of Assignor's Interest
May 12, 2008
From: BHAKTA JAYESH R.; YU ENCHAO; CHEN CHI SHE; FLAIG RICHARD E.
To: NETLIST, INC.
Reel/Frame 020943/0765 →
Assignment of Assignor's Interest
Jul 16, 2009
From: LEE, HYUN; BHAKTA, JAYESH R.
To: NETLIST INC.
Reel/Frame 022965/0347 →
Assignment of Assignor's Interest
Oct 19, 2010
From: LEE, HYUN; BHAKTA, JAYESH R.
To: NETLIST, INC.
Reel/Frame 025165/0454 →
Assignment of Assignor's Interest
Jan 3, 2012
From: LEE, HYUN
To: NETLIST, INC.
Reel/Frame 027520/0280 →
Assignment of Assignor's Interest
May 21, 2012
From: LEE, HYUN; BHAKTA, JAYESH R.; SHETH, PARESH
To: NETLIST, INC.
Reel/Frame 028278/0219 →
Security Interest
Nov 20, 2015
From: NETLIST, INC.
To: SVIC NO. 28 NEW TECHNOLOGY BUSINESS INVESTMENT L.L.P.
Reel/Frame 037150/0897 →
Termination of Intellectual Property Security Agreement
Dec 3, 2015
From: DBD CREDIT FUNDING LLC
To: NETLIST, INC.
Reel/Frame 037209/0158 →
Release of Security Interest
Nov 20, 2023
From: SVIC. NO. 28 NEW TECHNOLOGY BUSINESS INVESTMENT L.L.P.
To: NETLIST, INC
Reel/Frame 065629/0328 →