Memory module having thermal conduits

1. A memory module having at least a first side, the memory module comprising:

a plurality of integrated circuit packages on the first side, the plurality of integrated circuit packages comprising a first set of integrated circuit packages and a second set of one or more integrated circuit packages, wherein the first set of integrated circuit packages comprises a first plurality of dynamic random-access memory (DRAM) devices and the second set of one or more integrated circuit packages comprises an advanced memory buffer;

a first thermal conduit in thermal communication with the first set of integrated circuit packages and substantially thermally isolated from the second set of one or more integrated circuit packages;

a second thermal conduit in thermal communication with the second set of one or more integrated circuit packages; and

a second side, a second plurality of dynamic random-access memory (DRAM) devices on the second side, and a thermally conductive material between and in thermal communication with the second thermal conduit and at least one DRAM device on the second side.

2. The memory module of claim 1 , further comprising a third thermal conduit in thermal communication with at least one DRAM device of the plurality of DRAM devices on the second side.

3. The memory module of claim 2 , further comprising a fastener that applies a force to the first thermal conduit, the second thermal conduit, and the third thermal conduit.

4. The memory module of claim 1 , wherein at least one of the first thermal conduit and the second thermal conduit comprises a single unitary element.

5. The memory module of claim 1 , wherein the second thermal conduit is substantially thermally isolated from the first thermal conduit.

6. The memory module of claim 1 , wherein the first thermal conduit comprises a first portion in thermal communication with the first set of integrated circuit packages and a second portion having a surface extending generally parallel to the first portion, wherein the first portion and the second portion generally define a region therebetween through which air can flow.

7. The memory module of claim 6 , wherein the first portion has a cutout to allow substantial thermal isolation between the first thermal conduit and the second set of one or more integrated circuit packages.

8. A memory module having at least a first side, the memory module comprising:

a plurality of integrated circuit packages on the first side, the plurality of integrated circuit packages comprising a first set of integrated circuit packages and a second set of one or more integrated circuit packages, wherein the first set of integrated circuit packages comprises a first plurality of dynamic random-access memory (DRAM) devices and the second set of one or more integrated circuit packages comprises an advanced memory buffer;

a first thermal conduit in thermal communication with the first set of integrated circuit packages and substantially thermally isolated from the second set of one or more integrated circuit packages; and

a second thermal conduit in thermal communication with the second set of one or more integrated circuit packages, wherein the first thermal conduit comprises a hole which substantially thermally isolates the first thermal conduit from the advanced memory buffer.

9. The memory module of claim 8 , further comprising a thermally conductive material between and in thermal communication with the first thermal conduit and the first plurality of DRAM devices.

10. The memory module of claim 8 , wherein at least one of the first thermal conduit and the second thermal conduit comprises a single unitary element.

11. The memory module of claim 8 , wherein the first thermal conduit comprises a first portion in thermal communication with the first set of integrated circuit packages and wherein the hole is a cutout in the first portion.

12. The memory module of claim 11 , wherein the first thermal conduit further comprises a second portion and wherein the second portion comprises one or more generally planar portions.

13. The memory module of claim 12 , wherein the second portion comprises a surface extending generally parallel to the first portion, wherein the first portion and the second portion generally define a region therebetween through which air can flow.

14. The memory module of claim 11 , wherein the second thermal conduit is substantially thermally isolated from the first thermal conduit.

15. The memory module of claim 8 , further comprising a fastener configured to be mechanically coupled to the first thermal conduit and the second thermal conduit.

16. The memory module of claim 8 , wherein at least one of the first thermal conduit and the second thermal conduit comprises a metal sheet, wherein at least one of the first thermal conduit and the second thermal conduit comprises:

a first portion in thermal communication with at least one of the plurality of integrated circuit packages on the first side; and

a second portion comprising a surface extending generally parallel to the first portion, wherein the first portion and the second portion generally define a region therebetween through which air can flow.

17. The memory module of claim 16 , wherein the first portion is substantially flat.

18. The memory module of claim 16 , wherein the second portion comprises one or more generally planar surfaces.

19. The memory module of claim 16 , wherein the second portion comprises one or more angled or curved surfaces.

20. The memory module of claim 16 , wherein the metal sheet is cut, bent, or both cut and bent.

21. The memory module of claim 16 , wherein the region comprises a channel having a “C”-shaped cross-section.

22. The memory module of claim 16 , wherein the region comprises a channel having a “U”-shaped cross-section.

23. The memory module of claim 16 , wherein at least one of the first thermal conduit and the second thermal conduit is a single unitary sheet of material.

24. The memory module of claim 16 , wherein the second thermal conduit is substantially thermally isolated from the first thermal conduit.