Patent Assignment
Reel/Frame 065629/0328
Release of Security Interest
Recorded: 2023-11-20
Pages: 13
Assignor
SVIC. NO. 28 NEW TECHNOLOGY BUSINESS INVESTMENT L.L.P.
Executed: 2023-10-27
Assignee
NETLIST, INC
111 ACADEMY WAY, SUITE 100, IRVINE, CALIFORNIA, 92617
Covered Properties
(81)
Hybrid Memory System with Configurable Error Thresholds and Failure Analysis Capability
Non-Volatile Memory Storage for Multi-Channel Memory System
System and Method for Determining Charge of a Secondary Power Supply for a Memory System
Application:
62/102,996 →
Redundant Backup Using Non-Volatile Memory
Isolation Switching For Backup Memory
System And Method For Storing Manufacturing Information And Lifetime Usage History Of A Power Module For A Memory System
Application:
14/800,629 →
Publication:
US US20160018866A1
Flash-Dram Hybrid Memory Module
Memory Module with Data Buffering
Patent:
9,858,215 →
Application:
14/715,486 →
Memory Module and Circuit Providing Load Isolation and Noise Reduction
Patent:
10,025,731 →
Application:
14/715,491 →
Multi-Mode Memory Module with Data Handlers
Patent:
10,217,523 →
Application:
14/229,844 →
Memory Module with Distributed Data Buffers and Method of Operation
Systems and Methods for Handshaking with a Memory Module
Patent:
9,311,116 →
Application:
13/942,721 →
Memory Package with Optimized Driver Load and Method of Operation
Arrangement of Memory Devices in a Multi-Rank Memory Module
Patent:
9,426,916 →
Application:
13/964,103 →
Memory Module with Local Synchronization
Memory Module Having Volatile and Non-Volatile Memory Subsystems and Method of Operation
Method and Apparatus for Presearching Stored Data
Hybrid Memory Module and System and Method of Operating the Same
Hybrid Mobile Memory for Random Access
Application:
62/067,411 →
Hybrid Memory Module for Computer System
Application:
62/150,272 →
Non-Volatile Memory Module
Patent:
8,301,833 →
Application:
12/240,916 →
Data Transfer Scheme for Non-Volatile Memory Module
Isolation Switching for Backup Memory
Flash-Dram Hybrid Memory Module
Redundant Backup Using Non-Volatile Memory
Isolation Switching for Backup of Registered Memory
Isolation Switching For Backup Memory
Isolation Switching For Backup Of Registered Memory
Flash-Dram Hybrid Memory Module
Arrangement of Integrated Ciruits in a Memory Module
Arrangement of Integrated Circuits in a Memory Module
Arrangement of Integrated Circuits in a Memory Module
Arrangement of Integrated Circuits in a Memory Module
High-Density Memory Module Utilizing Low-Density Memory Components
Memory Module Decoder
Memory Module Decoder
Memory Module Decoder
Circuit for Providing Chip-Select Signals to a Plurality of Ranks of a Ddr Memory Module
Memory Module with a Circuit Providing Load Isolation and Memory Domain Translation
Memory Module with a Circuit Providing Load Isolation and Memory Domain Translation
Circuit Providing Load Isolation and Memory Domain Translation for Memory Module
Circuit Providing Load Isolation and Memory Domain Translation for Memory Module
Circuit Providing Load Isolation and Memory Domain Translation for Memory Module
Patent:
8,072,837 →
Application:
12/981,380 →
Circuit for Providing Chip-Select Signals to a Plurality of Ranks of a Ddr Memory Module
Patent:
8,081,537 →
Application:
13/154,172 →
Multirank Ddr Memory Modual with Load Reduction
Patent:
8,756,364 →
Application:
13/287,042 →
Circuit for Memory Module
Patent:
8,081,536 →
Application:
13/032,470 →
Circuit for Memory Module
Patent:
8,516,188 →
Application:
13/287,081 →
Memory Module with Load Reducing Circuit and Method of Operation
High Density Memory Module Using Stacked Printed Circuit Boards
High Density Memory Module Using Stacked Printed Circuit Boards
High Density Module Having at Least Two Substrates and at Least One Thermally Conductive Layer Therebetween
Module Having at Least Two Surfaces and at Least One Thermally Conductive Layer Therebetween
Module Having at Least One Thermally Conductive Layer Between Printed Circuit Boards
Patent:
8,971,045 →
Application:
13/731,014 →
Module Having at Least Two Surfaces and at Least One Thermally Conductive Layer Therebetween
Circuit Card with Flexible Connection for Memory Module with Heat Spreader
Patent:
7,442,050 →
Application:
11/511,523 →
Circuit with Flexible Portion
Patent:
7,811,097 →
Application:
12/237,162 →
Circuit with Flexible Portion
Patent:
8,033,836 →
Application:
12/874,900 →
Circuit with Flexible Portion
Patent:
8,287,291 →
Application:
13/231,870 →
Electronic Module with Flexible Portion
Patent:
8,864,500 →
Application:
13/653,254 →
Heat Spreader for Electronic Modules
Patent:
7,619,893 →
Application:
11/707,625 →
Heat Spreader for Memory Modules
Patent:
7,839,643 →
Application:
12/617,665 →
Memory Module Having Thermal Conduits
Patent:
8,488,325 →
Application:
12/916,945 →
Circuit Providing Load Isolation and Noise Reduction
Patent:
8,154,901 →
Application:
12/422,853 →
Circuit Providing Load Isolation and Noise Reduction
Memory Module With Circuit Providing Load Isolation and Noise Reduction
Patent:
9,037,809 →
Application:
14/324,990 →
Memory Board with Self-Testing Capability
Patent:
8,001,434 →
Application:
12/422,925 →
Memory Board with Self-Testing Capability
Patent:
8,359,501 →
Application:
13/183,253 →
Apparatus and Method for Self-Test in a Multi-Rank Memory Module
Patent:
8,689,064 →
Application:
13/745,790 →
System and Method of Increasing Addressable Memory Space on a Memory Board
System and Method Utilizing Distributed Byte-Wise Buffers on a Memory Module
Heat Dissipation for Electronic Modules
Patent:
8,018,723 →
Application:
12/432,591 →
Heat Dissipation for Electronic Modules
Patent:
8,705,239 →
Application:
13/205,477 →
Systems and Methods for Refreshing a Memory Module
Patent:
8,264,903 →
Application:
12/774,632 →
Circuit and Method for Refreshing a Memory Module
Patent:
8,599,634 →
Application:
13/584,679 →
Systems and Methods for Handshaking with a Memory Module
Patent:
8,489,837 →
Application:
12/815,339 →
Method and Apparatus for Optimizing Driver Load in a Memory Package
Memory Module with Distributed Data Buffers and Method of Operation
Flash-Dram Hybrid Memory Module
PCT:
PCT/US2012/048750 ↗
Memory System with Configurable Error Thresholds and Failure Analysis Capability
PCT:
PCT/US2014/030050 ↗
Memory Module with Local Synchronization
PCT:
PCT/US2014/048517 ↗
Hybrid Memory Module and System and Method of Operating the Same
PCT:
PCT/US2014/064698 ↗
Related Assignments
(13)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 6, 2012
From: CHEN, CHI-SHE; SOLOMON, JEFFREY C.; MILTON, SCOTT; BHAKTA, JAYESH
To: NETLIST, INC.
Reel/Frame 028504/0323 →
Assignment of Assignor's Interest
Oct 22, 2013
From: BHAKTA, JAYESH R.; NGUYEN, SON H
To: NETLIST, INC.
Reel/Frame 031456/0629 →
Assignment of Assignor's Interest
Sep 18, 2014
From: LEE, HYUN
To: NETLIST, INC.
Reel/Frame 033770/0722 →
Assignment of Assignor's Interest
Jan 6, 2015
From: MILTON, SCOTT H.; SOLOMON, JEFFREY C.; POST, KENNETH S.
To: NETLIST, INC.
Reel/Frame 034642/0407 →
Assignment of Assignor's Interest
Apr 18, 2015
From: LEE, HYUN; BHAKTA, JAYESH R; CHEN, CHI SHE; SOLOMON, JEFFERY C.
To: NETLIST, INC.
Reel/Frame 035442/0749 →
Assignment of Assignor's Interest
Aug 21, 2015
From: MILTON, SCOTT H.
To: NETLIST, INC.
Reel/Frame 036393/0086 →
Assignment of Assignor's Interest
Aug 25, 2015
From: CHEN, CHI-SHE; SOLOMON, JEFFREY C.; MILTON, SCOTT M.; BHAKTA, JAYESH
To: NETLIST, INC.
Reel/Frame 036407/0971 →
Security Interest
Nov 20, 2015
From: NETLIST, INC.
To: SVIC NO. 28 NEW TECHNOLOGY BUSINESS INVESTMENT L.L.P.
Reel/Frame 037150/0897 →
Assignment of Assignor's Interest
Apr 17, 2016
From: LEE, HYUN
To: NETLIST, INC.
Reel/Frame 038300/0110 →
Assignment of Assignor's Interest
Apr 17, 2016
From: LEE, HYUN; BHAKTA, JAYESH R.
To: NETLIST, INC.
Reel/Frame 038300/0101 →
Assignment of Assignor's Interest
Apr 17, 2016
From: LEE, HYUN
To: NETLIST, INC.
Reel/Frame 038300/0107 →
Assignment of Assignor's Interest
Nov 10, 2017
From: SOLOMON, JEFFREY C.; BHAKTA, JAYESH R.
To: NETLIST, INC.
Reel/Frame 044088/0994 →
Assignment of Assignor's Interest
Aug 23, 2023
From: LEE, HYUN
To: NETLIST, INC
Reel/Frame 064686/0749 →