Module having at least two surfaces and at least one thermally conductive layer therebetween

1. A module connectable to a computer system, the module comprising:

a first surface and a first plurality of circuit packages coupled to the first surface and in electrical communication with the computer system when the module is connected to the computer system;

a second surface and a second plurality of circuit packages coupled to the second surface and in electrical communication with the computer system when the module is connected to the computer system, the second surface facing the first surface; and

at least one thermal conduit between the first surface and the second surface and in thermal communication with the first plurality of circuit packages and the second plurality of circuit packages, the at least one thermal conduit in electrical communication with the computer system when the module is connected to the computer system.

2. The module of claim 1 , wherein the at least one thermal conduit comprises at least one sheet of copper.

3. The module of claim 1 , further comprising at least one multilayer structure in electrical communication with the first plurality of circuit packages and with the second plurality of circuit packages.

4. The module of claim 3 , wherein the at least one multilayer structure comprises an edge connector comprising a plurality of electrical contacts in electrical communication with the computer system when the module is connected to the computer system.

5. The module of claim 4 , wherein the at least one multilayer structure further comprises the at least one thermal conduit.

6. The module of claim 3 , wherein the at least one multilayer structure comprises a lamination of layers of electrically insulative materials and electrically conductive materials.

7. The module of claim 1 , further comprising a plurality of electrical contacts that are electrically connectable to the computer system, wherein the plurality of electrical contacts comprises electrical contacts in electrical communication with the first plurality of circuit packages and with the second plurality of circuit packages.

8. The module of claim 7 , wherein the plurality of electrical contacts comprises electrical contacts in thermal communication with the at least one thermal conduit.

9. The module of claim 1 , wherein the first surface and the second surface are generally parallel to one another.

10. The module of claim 1 , wherein the first plurality of circuit packages comprises memory integrated circuit packages and the second plurality of circuit packages comprises memory integrated circuit packages.

11. The module of claim 1 , wherein the at least one thermal conduit is in thermal communication with the computer system when the module is connected to the computer system.

12. The module of claim 1 , wherein the at least one thermal conduit comprises a first thermally conductive layer in thermal communication with the first plurality of circuit packages, a second thermally conductive layer in thermal communication with the second plurality of circuit packages, a dielectric layer between the first thermally conductive layer and the second thermally conductive layer, and a plurality of electrical contacts in electrical communication with the computer system when the module is connected to the computer system.

13. The module of claim 12 , wherein the first thermally conductive layer is thermally and electrically coupled to a first set of electrical contacts of the plurality of electrical contacts and the second thermally conductive layer is thermally and electrically coupled to a second set of electrical contacts of the plurality of electrical contacts.

14. The module of claim 13 , wherein the first thermally conductive layer and the second thermally conductive layer are in electrical communication with one another.

15. The module of claim 13 , wherein the first thermally conductive layer and the second thermally conductive layer are electrically isolated from one another.

16. A computer system comprising:

a first plurality of circuit packages coupled to a first surface of a module;

a second plurality of circuit packages coupled to a second surface of the module, the second surface facing the first surface; and

at least one thermal conduit between the first surface and the second surface and in thermal communication with the first plurality of circuit packages and the second plurality of circuit packages, wherein the at least one thermal conduit is in electrical communication with a socket of the computer system, wherein the at least one thermal conduit is configured to provide a thermal pathway for heat flow away from the first plurality of circuit packages and the second plurality of circuit packages.

17. The module of claim 16 , wherein the first surface and the second surface are generally parallel to one another.

18. The module of claim 16 , further comprising at least one multilayer structure in electrical communication with the first plurality of circuit packages and with the second plurality of circuit packages.

19. The module of claim 18 , wherein the at least one multilayer structure further comprises the at least one thermal conduit.

20. A memory module configured to be connected to a computer system, the memory module comprising:

at least one thermal conduit in electrical communication with the computer system when the memory module is connected to the computer system;

a first side facing the at least one thermal conduit, the first side having a first plurality of circuit packages coupled thereto, the first plurality of circuit packages in thermal communication with the at least one thermal conduit; and

a second side facing the at least one thermal conduit, the second side having a second plurality of circuit packages coupled thereto, the second plurality of circuit packages in thermal communication with the at least one thermal conduit, wherein the at least one thermal conduit is between the first side and the second side.

21. The memory module of claim 20 , further comprising a third side facing away from the first side, the third side having a third plurality of circuit packages coupled thereto.

22. The memory module of claim 21 , further comprising a fourth side facing away from the second side, the fourth side having a fourth plurality of circuit packages coupled thereto.

23. The computer system of claim 16 , wherein the at least one thermal conduit is in thermal communication with the socket.

24. The computer system of claim 16 , wherein the at least one thermal conduit comprises a first thermally conductive layer in thermal communication with the first plurality of circuit packages, a second thermally conductive layer in thermal communication with the second plurality of circuit packages, a dielectric layer between the first thermally conductive layer and the second thermally conductive layer, and a plurality of electrical contacts in electrical communication with the socket.

25. The computer system of claim 24 , wherein the first thermally conductive layer is thermally and electrically coupled to a first set of electrical contacts of the plurality of electrical contacts and the second thermally conductive layer is thermally and electrically coupled to a second set of electrical contacts of the plurality of electrical contacts.

26. The module of claim 25 , wherein the first thermally conductive layer and the second thermally conductive layer are in electrical communication with one another.

27. The module of claim 25 , wherein the first thermally conductive layer and the second thermally conductive layer are electrically isolated from one another.

28. The memory module of claim 20 , wherein the at least one thermal conduit is in thermal communication with the computer system when the memory module is connected to the computer system.

29. The memory module of claim 20 , wherein the at least one thermal conduit comprises a first thermally conductive layer in thermal communication with the first plurality of circuit packages, a second thermally conductive layer in thermal communication with the second plurality of circuit packages, a dielectric layer between the first thermally conductive layer and the second thermally conductive layer, and a plurality of electrical contacts in electrical communication with the computer system when the memory module is connected to the computer system.

30. The memory module of claim 29 , wherein the first thermally conductive layer is thermally and electrically coupled to a first set of electrical contacts of the plurality of electrical contacts and the second thermally conductive layer is thermally and electrically coupled to a second set of electrical contacts of the plurality of electrical contacts.

31. The memory module of claim 30 , wherein the first thermally conductive layer and the second thermally conductive layer are in electrical communication with one another.

32. The memory module of claim 30 , wherein the first thermally conductive layer and the second thermally conductive layer are electrically isolated from one another.