Patent Assignment
Reel/Frame 017765/0219
Assignment of Assignor's Interest
Recorded: 2006-04-14
Pages: 4
Assignor
NEC COMPOUND SEMICONDUCTOR DEVICES, LTD.
Executed: 2006-03-15
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN
Covered Property
(1)
Semiconductor Device and Method of Manufacturing the Same
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 23, 2004
From: ISHIGAKI, TAKASHI; NIWA, TAKAKI; KUROSAWA, NAOTO; SHIMAWAKI, HIDENORI
To: NEC COMPOUND SEMICONDUCTOR DEVICES, LTD.; NEC CORPORATION
Reel/Frame 016027/0798 →
Change of Name
Nov 11, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025346/0840 →
Assignment of Assignor's Interest
Jul 12, 2013
From: NEC CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 030783/0873 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →