Patent Assignment
Reel/Frame 017786/0301
Assignment of Assignor's Interest
Recorded: 2006-04-07
Pages: 3
Assignors
YABUKI, SHINJI
Executed: 2006-02-07
WACHI, MICHINORI
Executed: 2006-02-07
DAIHOU, KOUJI
Executed: 2006-02-07
Assignee
HITACHI CABLE, LTD.
6-1, OTEMACHI 1-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Semiconductive Gaas Wafer and Method of Making the Same
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger and Change of Name
Dec 15, 2014
From: HITACHI CABLE, LTD.; HITACHI METALS, LTD.
To: HITACHI METALS, LTD.
Reel/Frame 034630/0897 →
Company Split
Jul 24, 2015
From: HITACHI METALS, LTD.
To: SCIOCS COMPANY LIMITED
Reel/Frame 036181/0104 →
Assignment of Assignor's Interest
Feb 16, 2016
From: SCIOCS COMPANY LIMITED
To: SUMITOMO CHEMICAL COMPANY, LIMITED
Reel/Frame 037827/0453 →