IP Library Assignment 017933/0052
Patent Assignment
Reel/Frame 017933/0052

Assignment of Assignor's Interest

Recorded: 2005-11-14 Pages: 3
Assignors
HATAKEYAMA, KEIICHI
Executed: 2005-11-10
URUNO, MICHIO
Executed: 2005-11-10
MATSUZAKI, TAKAYUKI
Executed: 2005-11-10
MORISHIMA, YASUMASA
Executed: 2005-10-24
KITA, KENJI
Executed: 2005-10-29
ISHIWATA, SHINICHI
Executed: 2005-10-24
Assignees
HITACHI CHEMICAL CO., LTD.
1-1, NISHINJUKU 2-CHOME, CHIYODA-KU, TOKYO, 100-8322, JAPAN
FURUKAWA ELECTRIC CO., LTD., THE
6-1, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, 100-8322, JAPAN
Covered Property (1)
Dicing/Die Bonding Sheet
Patent: 7,517,724 →
Application: 10/556,535 →
Publication: US 2007/0026572
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Mar 6, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062956/0484 →
Change of Name Mar 7, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062967/0818 →
Change of Address Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →