Patent Assignment
Reel/Frame 062956/0484
Change of Name
Recorded: 2023-03-06
Pages: 11
Assignor
HITACHI CHEMICAL COMPANY, LTD.
Executed: 2020-10-01
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Dicing/Die Bonding Sheet
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 14, 2005
From: HATAKEYAMA, KEIICHI; URUNO, MICHIO; MATSUZAKI, TAKAYUKI; MORISHIMA, YASUMASA
To: HITACHI CHEMICAL CO., LTD.; FURUKAWA ELECTRIC CO., LTD., THE
Reel/Frame 017933/0052 →
Change of Name
Mar 7, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062967/0818 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →