IP Library › Assignment 062967/0818
Patent Assignment
Reel/Frame 062967/0818

Change of Name

Recorded: 2023-03-07 Pages: 11
Assignor
SHOWA DENKO MATERIALS CO., LTD.
Executed: 2023-01-01
Assignee
RESONAC CORPORATION
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
Covered Property (1)
Dicing/Die Bonding Sheet
Patent: 7,517,724 →
Application: 10/556,535 →
Publication: US 2007/0026572
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 14, 2005
From: HATAKEYAMA, KEIICHI; URUNO, MICHIO; MATSUZAKI, TAKAYUKI; MORISHIMA, YASUMASA
To: HITACHI CHEMICAL CO., LTD.; FURUKAWA ELECTRIC CO., LTD., THE
Reel/Frame 017933/0052 →
Change of Name Mar 6, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062956/0484 →
Change of Address Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →