Patent Assignment
Reel/Frame 018023/0427
Assignment of Assignor's Interest
Recorded: 2006-07-31
Pages: 4
Assignor
AKRION, INC.
Executed: 2006-07-26
Assignee
AKRION TECHNOLOGIES, INC.
1101 N. MARKET ST.- SUITE 1300, PHILADELPHIA, PENNSYLVANIA, 19103
Covered Property
(1)
Method and system for processing substrates with sonic energy that reduces or eliminates damage to semiconductor devices
Application:
11/370,707 →
Publication:
US 2006/0260639
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
Jul 19, 2006
From: AKRION TECHNOLOGIES, INC.
To: PNC BANK, NATIONAL ASSOCIATION
Reel/Frame 017961/0645 →
Assignment of Assignor's Interest
Jul 25, 2006
From: FANI, PEJMAN; KASHKOUSH, ISMAIL; KORBLER, JOHN; VOHRA, VIVEK
To: AKRION, INC.
Reel/Frame 017992/0401 →
Security Agreement
Aug 24, 2006
From: AKRION TECHNOLOGIES, INC.
To: BHC INTERIM FUNDING II, L.P.
Reel/Frame 018160/0597 →
Release of Security Interest in Patents
Aug 24, 2006
From: ORIX VENTURE FINANCE LLC
To: GOLDFINGER TECHNOLOGIES, LLC; AKRION INC.
Reel/Frame 018160/0627 →
Assignment of Assignor's Interest
Jan 19, 2018
From: AKRION SYSTEMS LLC
To: NAURA AKRION INC.
Reel/Frame 045097/0140 →