Patent Assignment
Reel/Frame 018159/0322
Assignment of Assignor's Interest
Recorded: 2006-08-23
Pages: 4
Assignors
HOENTSCHEL, JAN
Executed: 2005-12-01
WEI, ANDY
Executed: 2005-12-01
HORSTMANN, MANFRED
Executed: 2005-12-01
KAMMLER, THORSTEN
Executed: 2005-12-01
Assignee
ADVANCED MICRO DEVICES, INC.
5204 EAST BEN WHITE BOULEVARD, AUSTIN, TEXAS, 78741
Covered Property
(1)
Embedded Strain Layer in Thin Soi Transistors and a Method of Forming the Same
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Affirmation of Patent Assignment
Aug 18, 2009
From: ADVANCED MICRO DEVICES, INC.
To: GLOBALFOUNDRIES INC.
Reel/Frame 023119/0083 →
Security Agreement
Nov 29, 2018
From: GLOBALFOUNDRIES INC.
To: WILMINGTON TRUST, NATIONAL ASSOCIATION
Reel/Frame 049490/0001 →
Release of Security Interest
Nov 20, 2020
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES INC.
Reel/Frame 054636/0001 →
Release of Security Interest
May 12, 2021
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES U.S. INC.
Reel/Frame 056987/0001 →