Patent Assignment
Reel/Frame 018172/0631
Assignment of Assignor's Interest
Recorded: 2006-08-08
Pages: 2
Assignors
OHSHIMA, YOSHIMASA
Executed: 2006-07-07
UTO, SACHIO
Executed: 2006-07-07
SHIBATA, YUKIHIRO
Executed: 2006-07-07
Assignee
HITACHI HIGH-TECHNOLOGIES CORPORATION
24-14, NISHINBASHI 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Method and Apparatus for Detecting Defects on a Wafer
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Re-Record to Correct the Address of the Assignee, Previously Recorded on Reel 018172 Frame 0631.
Aug 13, 2009
From: OHSHIMA, YOSHIMASA; UTO, SACHIO; SHIBATA, YUKIHIRO
To: HITACHI HIGH-TECHNOLOGIES CORPORATION
Reel/Frame 023086/0040 →
Change of Name and Address
Mar 30, 2020
From: HITACHI HIGH-TECHNOLOGIES CORPORATION
To: HITACHI HIGH-TECH CORPORATION
Reel/Frame 052259/0227 →