IP Library Assignment 018196/0144
Patent Assignment
Reel/Frame 018196/0144

Assignment of Assignor's Interest

Recorded: 2006-08-31 Pages: 8
Assignors
RICHARDSON, THOMAS B.
Executed: 2006-08-28
KLEINFELD, MARLIES
Executed: 2006-08-12
RIETMANN, CHRISTIAN
Executed: 2006-08-17
ZAVARINE, IGOR
Executed: 2006-08-23
STEINIUS, ORTRUD
Executed: 2006-08-17
ZHANG, YUN
Executed: 2006-08-21
ABYS, JOSEPH A.
Executed: 2006-08-21
Assignee
ENTHONE INC.
350 FRONTAGE ROAD, WEST HAVEN, CONNECTICUT, 06516
Covered Property (1)
Tin-Silver Solder Bumping in Electronics Manufacture
Patent: 7,713,859 →
Application: 11/463,355 →
Publication: US 2007/0037377
Related Assignments (5)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement Apr 15, 2016
From: ENTHONE INC.
To: BARCLAYS BANK PLC, AS COLLATERAL AGENT
Reel/Frame 038439/0777 →
Release of Security Interest Feb 4, 2019
From: BARCLAYS BANK PLC, AS COLLATERAL AGENT
To: MACDERMID ENTHONE INC. (F/K/A ENTHONE INC.)
Reel/Frame 048233/0141 →
Security Interest Feb 5, 2019
From: MACDERMID ENTHONE INC. (F/K/A ENTHONE INC.)
To: BARCLAYS BANK PLC, AS COLLATERAL AGENT
Reel/Frame 048261/0110 →
Change of Name Feb 15, 2019
From: ENTHONE INC.
To: MACDERMID ENTHONE INC.
Reel/Frame 048355/0656 →
Assignment of Security Interest in Patent Collateral Nov 17, 2022
From: BARCLAYS BANK PLC
To: CITIBANK, N.A.
Reel/Frame 061956/0643 →