IP Library › Assignment 018199/0733
Patent Assignment
Reel/Frame 018199/0733

Assignment of Assignor's Interest

Recorded: 2006-08-30 Pages: 3
Assignors
WU, YAN-YI
Executed: 2006-07-26
LI, XIN-MING
Executed: 2006-07-27
HUANG, CHIH-LUNG
Executed: 2006-07-27
Assignees
CHIPMOS TECHNOLGIES (SHANGHAI) LTD.
9688 SONGZE AVE., QINGPU INDUSTRIAL ZONE, SHANGHAI, CHINA
CHIPMOS TECHNOLOGIES (BERMUDA) LTD.
CANON'S COURT, 22 VICTORIA STREET, HAMILTON HM12, BERMUDA
Covered Property (1)
Chip Package Structure
Patent: 7,361,984 →
Application: 11/468,600 →
Publication: US 2008/0017958
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Apr 19, 2019
From: CHIPMOS TECHNOLGIES (SHANGHAI) LTD.
To: UNIMOS MICROELECTRONICS (SHANGHAI) CO., LTD.
Reel/Frame 048947/0319 →
Merger Apr 19, 2019
From: CHIPMOS TECHNOLOGIES (BERMUDA) LTD.
To: CHIPMOS TECHNOLOGIES INC.
Reel/Frame 048947/0332 →