IP Library › Assignment 048947/0319
Patent Assignment
Reel/Frame 048947/0319

Change of Name

Recorded: 2019-04-19 Pages: 3
Assignor
Assignee
UNIMOS MICROELECTRONICS (SHANGHAI) CO., LTD.
9688 SONGZE AVE., QINGPU INDUSTRIAL ZONE,, SHANGHAI, CHINA
Covered Property (1)
Chip Package Structure
Patent: 7,361,984 →
Application: 11/468,600 →
Publication: US 2008/0017958
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 30, 2006
From: WU, YAN-YI; LI, XIN-MING; HUANG, CHIH-LUNG
To: CHIPMOS TECHNOLGIES (SHANGHAI) LTD.; CHIPMOS TECHNOLOGIES (BERMUDA) LTD.
Reel/Frame 018199/0733 →
Merger Apr 19, 2019
From: CHIPMOS TECHNOLOGIES (BERMUDA) LTD.
To: CHIPMOS TECHNOLOGIES INC.
Reel/Frame 048947/0332 →