IP Library › Assignment 048947/0332
Patent Assignment
Reel/Frame 048947/0332

Merger

Recorded: 2019-04-19 Pages: 2
Assignor
Assignee
CHIPMOS TECHNOLOGIES INC.
NO. 1, R&D 1ST RD., SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, TAIWAN
Covered Property (1)
Chip Package Structure
Patent: 7,361,984 →
Application: 11/468,600 →
Publication: US 2008/0017958
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 30, 2006
From: WU, YAN-YI; LI, XIN-MING; HUANG, CHIH-LUNG
To: CHIPMOS TECHNOLGIES (SHANGHAI) LTD.; CHIPMOS TECHNOLOGIES (BERMUDA) LTD.
Reel/Frame 018199/0733 →
Change of Name Apr 19, 2019
From: CHIPMOS TECHNOLGIES (SHANGHAI) LTD.
To: UNIMOS MICROELECTRONICS (SHANGHAI) CO., LTD.
Reel/Frame 048947/0319 →