IP Library Assignment 018380/0758
Patent Assignment
Reel/Frame 018380/0758

Assignment of Assignor's Interest

Recorded: 2006-10-10 Pages: 5
Assignors
SHENG, QUAN
Executed: 2006-08-09
THOMAS, MURIEL
Executed: 2006-07-26
NACHREINER, JENS
Executed: 2006-08-02
Assignee
UMICORE AG & CO., KG
RODENBACHER CHAUSSEE 4, HANAU-WOLFGANG, D-63457, GERMANY
Covered Property (1)
No-Clean Low-Residue Solder Paste for Semiconductor Device Applications
Patent: 7,767,032 →
Application: 11/479,374 →
Publication: US 2008/0000549
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 5, 2009
From: UMICORE AG & CO. KG
To: W.C. HERAEUS GMBH
Reel/Frame 023055/0026 →
Change of Name Mar 8, 2012
From: W.C. HERAEUS GMBH
To: HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
Reel/Frame 027830/0077 →
Change of Name May 19, 2015
From: HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
To: HERAEUS DEUTSCHLAND GMBH & CO. KG
Reel/Frame 035744/0381 →