IP Library Assignment 023055/0026
Patent Assignment
Reel/Frame 023055/0026

Assignment of Assignor's Interest

Recorded: 2009-08-05 Pages: 4
Assignor
UMICORE AG & CO. KG
Executed: 2009-04-30
Assignee
W.C. HERAEUS GMBH
HERAEUSSTRASSE 12-14, HANAU, D-63450, GERMANY
Covered Property (1)
No-Clean Low-Residue Solder Paste for Semiconductor Device Applications
Patent: 7,767,032 →
Application: 11/479,374 →
Publication: US 2008/0000549
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 10, 2006
From: SHENG, QUAN; THOMAS, MURIEL; NACHREINER, JENS
To: UMICORE AG & CO., KG
Reel/Frame 018380/0758 →
Change of Name Mar 8, 2012
From: W.C. HERAEUS GMBH
To: HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
Reel/Frame 027830/0077 →
Change of Name May 19, 2015
From: HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
To: HERAEUS DEUTSCHLAND GMBH & CO. KG
Reel/Frame 035744/0381 →