IP Library Assignment 018390/0216
Patent Assignment
Reel/Frame 018390/0216

Assignment of Assignor's Interest

Recorded: 2006-10-13 Pages: 3
Assignors
LEE, WEN-CHIN
Executed: 2006-09-22
LIN, CHENG-HSIEN
Executed: 2006-09-22
Assignee
FOXCONN ADVANCED TECHNOLOGY INC.
NO. 6, LANE 28, SAN HO RD., SAN SHI VILLAGE, TAYUAN, TAOYUAN, TAIWAN
Covered Property (1)
Method for Forming Stacked via-Holes in Printed Circuit Boards
Patent: 7,488,428 →
Application: 11/309,852 →
Publication: US 2007/0269588
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Sep 13, 2011
From: FOXCONN ADVANCED TECHNOLOGY INC.
To: ZHEN DING TECHNOLOGY CO., LTD.
Reel/Frame 026893/0752 →
Assignment of Assignor's Interest Jan 16, 2017
From: ZHEN DING TECHNOLOGY CO., LTD.
To: GARUDA TECHNOLOGY CO., LTD
Reel/Frame 040978/0629 →