Assignment of Assignor's Interest

Recorded: 2017-01-16 Pages: 4

Assignor

ZHEN DING TECHNOLOGY CO., LTD.

Executed: 2017-01-01

Assignee

GARUDA TECHNOLOGY CO., LTD

4F., NO.156,SEC 1,ZHONGSHAN RD.,BANQIAO DIST.,,NEW TAIPEI CITY 22065,TAIWAN(R.O.C), NEW TAIPEI, TAIWAN

Covered Property (1)

Method for Forming Stacked via-Holes in Printed Circuit Boards

Patent: 7,488,428 →

Application: 11/309,852 →

Publication: US 2007/0269588

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.