IP Library › Assignment 018420/0102
Patent Assignment
Reel/Frame 018420/0102

Security Agreement

Recorded: 2006-10-23 Received: 2006-10-23 Pages: 19
Assignor
Assignee
SILICON VALLEY BANK
3003 TASMAN DRIVE, SANTA CLARA, CA, 95054, UNITED STATES
Covered Properties (26)
Product Information System
Application: 60/806,459 →
Crimped tube electrical test socket pin
Application: 60/765,549 →
Active test socket
Application: 60/765,555 →
Compressive conductors for semiconductor testing
Application: 60/765,710 →
Connector System
Connector System
Test Socket and Method for Making
Multipath interconnect with meandering contact cantilevers
Application: 11/281,848 →
Interconnect assembly for testing integrated circuit packages
Application: 60/735,939 →
Interconnect Assembly for a Probe Card
Modular Semiconductor Package Testing Contactor System
Multipath Interconnect with Meandering Contact Cantilevers
Application: 11/125,035 →
See-Saw Interconnect Assembly with Dielectric Carrier Grid Providing Spring Suspension
Application: 11/077,054 →
Connector assembly
Application: 60/646,927 →
Connector system
Application: 60/645,895 →
Test socket and method for making
Application: 60/634,217 →
Multipath Interconnect with Meandering Contact Cantilevers
Test Pin Back Surface in Probe Apparatus for Low Wear Multiple Contacting with Conductive Elastomer
See-Saw Interconnect Assembly with Dielectric Carrier Grid Providing Spring Suspension
Modular contactor system, spring probe based
Application: 60/587,761 →
Die Identification Systems and Methods
Application: 10/883,316 →
Test pin back surface in probe apparatus for low wear multiple contacting with conductive elastomer
Application: 10/775,828 →
See-Saw Interconnect Assembly with Dielectric Carrier Grid Providing Spring Suspension
Application: 10/759,338 →
Sheet Metal Interconnect Array
Application: 29/194,881 →
Multipath Interconnect with Meandering Contact Cantilevers
Application: 10/700,401 →
Bundled Probe Apparatus for Multiple Terminal Contacting
Application: 09/775,676 →