IP Library › Patent Application 60735939
Patent Application Provisional
App. No. 60/735,939 · Confirmation No. 1171

Interconnect assembly for testing integrated circuit packages

Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2005-11-10 TRNA Transmittal of New Application 3 View
2005-11-10 SPEC Specification 12 View
2005-11-10 CLM Claims 3 View
2005-11-10 ABST Abstract 1 View
2005-11-10 DRW Drawings-only black and white line drawings 7 View
2005-11-10 WFEE Fee Worksheet (SB06) 1 View
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Quick Facts
App. No.
60/735,939
Filed
2005-11-10