Patent Assignment
Reel/Frame 022557/0192
Assignment of Assignor's Interest
Recorded: 2009-04-16
Received: 2009-04-16
Pages: 7
Assignor
IDI SEMI, LLC
Executed: 2009-04-03
Assignee
INTERCONNECT DEVICES, INC.
501 RICHLAND AVENUE, KANSAS CITY, KS, 66106, UNITED STATES
Covered Properties
(20)
Spring Probe
Application:
12/105,922 →
Test Interconnect
Application:
12/054,281 →
Crimped Tube Electrical Test Socket Pin
Application:
11/671,986 →
Active Test Socket
Application:
11/671,963 →
Compressive Conductors for Semiconductor Testing
Application:
11/671,942 →
Interconnect Assembly for Testing Integrated Circuit Packages
Application:
11/558,603 →
Crimped tube electrical test socket pin
Application:
60/765,549 →
Active test socket
Application:
60/765,555 →
Compressive conductors for semiconductor testing
Application:
60/765,710 →
Interconnect assembly for testing integrated circuit packages
Application:
60/735,939 →
Interconnect Assembly for a Probe Card
Application:
11/198,995 →
Modular Semiconductor Package Testing Contactor System
Application:
11/177,673 →
Multipath Interconnect with Meandering Contact Cantilevers
Application:
11/125,035 →
See-Saw Interconnect Assembly with Dielectric Carrier Grid Providing Spring Suspension
Application:
11/077,054 →
Interposer with planar interconnects
Application:
60/600,512 →
Modular contactor system, spring probe based
Application:
60/587,761 →
See-Saw Interconnect Assembly with Dielectric Carrier Grid Providing Spring Suspension
Application:
10/759,338 →
Sheet Metal Interconnect Array
Application:
29/194,881 →
Multipath Interconnect with Meandering Contact Cantilevers
Application:
10/700,401 →
Bundled Probe Apparatus for Multiple Terminal Contacting
Application:
09/775,676 →