IP Library Granted Patent US 7,728,611
Granted Patent B1
US 7,728,611 · App. 11/671,942 · Granted Jun 1, 2010

Compressive conductors for semiconductor testing

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Quick Facts
Patent No.
US 7,728,611
App. No.
11/671,942
Granted
Jun 1, 2010
Kind
B1
Abstract

An interconnect assembly electrically connecting two circuit members, which include respective arrays of electrical contacts for engagement with the interconnect assembly. The interconnect assembly comprises a plurality of electrical conductors, the plurality of conductors arranged in a spaced arrangement, the spaced arrangement of the conductors substantially corresponding to a spaced arrangement for the respective arrays of electrical contacts to provide contact between the conductors and the contact arrays and a carrier, including a socket and a retainer. The socket includes a plurality of apertures each receiving an upper portion of one of the plurality of conductors and the retainer includes a plurality of apertures each receiving a lower portion of one of the plurality of conductors; and the respective apertures are aligned axially with each other.

Claims (31)

1. An interconnect assembly electrically connecting two circuit members, which include respective arrays of electrical contacts for engagement with the interconnect assembly, the interconnect assembly comprising:

a plurality of electrical conductors arranged in a spaced arrangement substantially corresponding to a spaced arrangement for the respective arrays of electrical contacts to provide contact between the conductors and the contact arrays, wherein the plurality of electrical conductors comprises;

a first electrical conductor, the first electrical conductor being a stamped collet spring pin assembly,

a second electrical conductor, the second electrical conductor being a direct contact collet spring assembly, and

a third electrical conductor, the third electrical conductor being a direct contact stamped collet spring assembly; and

a carrier including:

a socket member including a plurality of apertures each receiving an upper portion of one of the plurality of conductors wherein the socket member includes a first aperture that has a diameter larger than an outer diameter of a housing of the second conductor so that an annular gap is defined between the second conductor and the first aperture of the socket member; and

a retainer including a plurality of apertures each receiving a lower portion of one of the plurality of conductors,

wherein the respective apertures are aligned axially with each other.

2. An interconnect assembly electrically connecting two circuit members, which include respective arrays of electrical contacts for engagement with the interconnect assembly, the interconnect assembly comprising:

a plurality of electrical conductors arranged in a spaced arrangement substantially corresponding to a spaced arrangement for the respective arrays of electrical contacts to provide contact between the conductors and the contact arrays, wherein the plurality of electrical conductors comprises:

a first electrical conductor, the first electrical conductor being a stamped collet spring pin assembly,

a second electrical conductor, the second electrical conductor being a direct contact collet spring assembly, and

a third electrical conductor, the third electrical conductor being a direct contact stamped collet spring assembly,

wherein each conductor comprises a beam adapted to bow outwardly within the respective apertures when the respective conductor engages the respective array of contacts and is compressed; and

a carrier including:

a socket member including a plurality of apertures each receiving an upper portion of one of the plurality of conductors; and

a retainer including a plurality of apertures each receiving a lower portion of one of the plurality of conductors,

wherein the respective apertures are aligned axially with each other.

3. An interconnect assembly electrically connecting two circuit members, which include respective arrays of electrical contacts for engagement with the interconnect assembly, the interconnect assembly comprising:

a plurality of electrical conductors arranged in a spaced arrangement substantially corresponding to a spaced arrangement for the respective arrays of electrical contacts to provide contact between the conductors and the contact arrays; and

a carrier including:

a socket member including a plurality of apertures each receiving an upper portion of one of the plurality of conductors; and

a retainer including a plurality of apertures each receiving a lower portion of one of the plurality of conductors, wherein the retainer is made from polytetrafluoroethylene (PTFE),

wherein the respective apertures are aligned axially with each other.

4. An interconnect assembly electrically connecting two circuit members, which include respective arrays of electrical contacts for engagement with the interconnect assembly, the interconnect assembly comprising:

a plurality of electrical conductors arranged in a spaced arrangement substantially corresponding to a spaced arrangement for the respective arrays of electrical contacts to provide contact between the conductors and the contact arrays; and

a carrier including:

a socket member including a plurality of apertures each receiving an upper portion of one of the plurality of conductors, wherein the socket member is made from polytetrafluoroethylene (PTFE); and

a retainer including a plurality of apertures each receiving a lower portion of one of the plurality of conductors,

wherein the respective apertures are aligned axially with each other.

Assignments (7)
CHANGE OF NAME Recorded Mar 22, 2019
From: INTERCONNECT DEVICES, INC.
To: SMITHS INTERCONNECT AMERICAS, INC.
Reel/Frame 048667/0482 →
RELEASE OF SECURITY INTEREST Recorded Apr 9, 2010
From: MADISON CAPITAL FUNDING LLC, AS AGENT
To: INTERCONNECT DEVICES, INC.
Reel/Frame 024202/0605 →
FIRST AMENDMENT TO PATENT SECURITY AGREEMENT Recorded Apr 21, 2009
From: INTERCONNECT DEVICES, INC.
To: MADISON CAPITAL FUNDING, LLC, AS AGENT
Reel/Frame 022629/0029 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 16, 2009
From: IDI SEMI, LLC
To: INTERCONNECT DEVICES, INC.
Reel/Frame 022557/0192 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 16, 2009
From: ANTARES ADVANCED TEST TECHNOLOGIES, INC.
To: IDI SEMI, LLC
Reel/Frame 022557/0050 →
RELEASE Recorded Apr 16, 2009
From: SILICON VALLEY BANK
To: ANTARES ADVANCED TEST TECHNOLOGIES, INC.
Reel/Frame 022668/0004 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 13, 2007
From: KRAYNAK, TIMOTHY L.
To: ANTARES ADVANCED TEST TECHNOLOGIES, INC.
Reel/Frame 019159/0207 →