IP Library › Assignment 022629/0029
Patent Assignment
Reel/Frame 022629/0029

First Amendment to Patent Security Agreement

Recorded: 2009-04-21 Received: 2009-04-21 Pages: 13
Assignor
INTERCONNECT DEVICES, INC.
Executed: 2009-04-03
Assignee
MADISON CAPITAL FUNDING, LLC, AS AGENT
30 S. WACKER, CHICAGO, IL, 60606, UNITED STATES
Covered Properties (21)
Spring Probe
Application: 12/105,922 →
Test Interconnect
Application: 12/054,281 →
Crimped Tube Electrical Test Socket Pin
Application: 11/671,986 →
Active Test Socket
Application: 11/671,963 →
Compressive Conductors for Semiconductor Testing
Application: 11/671,942 →
Interconnect Assembly for Testing Integrated Circuit Packages
Application: 11/558,603 →
Crimped tube electrical test socket pin
Application: 60/765,549 →
Active test socket
Application: 60/765,555 →
Compressive conductors for semiconductor testing
Application: 60/765,710 →
Interconnect assembly for testing integrated circuit packages
Application: 60/735,939 →
Interconnect Assembly for a Probe Card
Modular Semiconductor Package Testing Contactor System
Application: 11/177,673 →
Multipath Interconnect with Meandering Contact Cantilevers
Application: 11/125,035 →
See-Saw Interconnect Assembly with Dielectric Carrier Grid Providing Spring Suspension
Application: 11/077,054 →
Multipath Interconnect with Meandering Contact Cantilevers
See-Saw Interconnect Assembly with Dielectric Carrier Grid Providing Spring Suspension
Modular contactor system, spring probe based
Application: 60/587,761 →
See-Saw Interconnect Assembly with Dielectric Carrier Grid Providing Spring Suspension
Application: 10/759,338 →
Sheet Metal Interconnect Array
Application: 29/194,881 →
Multipath Interconnect with Meandering Contact Cantilevers
Application: 10/700,401 →
Bundled Probe Apparatus for Multiple Terminal Contacting
Application: 09/775,676 →