Patent Assignment
Reel/Frame 024202/0605
Release of Security Interest
Recorded: 2010-04-09
Received: 2010-04-09
Pages: 10
Assignor
MADISON CAPITAL FUNDING LLC, AS AGENT
Executed: 2010-04-06
Assignee
INTERCONNECT DEVICES, INC.
5101 RICHLAND AVENUE, KANSAS CITY, KS, 66106, UNITED STATES
Covered Properties
(33)
Moisture Barrier
Application:
29/324,751 →
Spring Probe
Application:
12/105,922 →
Test Interconnect
Application:
12/054,281 →
Adjustable Test Socket
Application:
11/715,712 →
Crimped Tube Electrical Test Socket Pin
Application:
11/671,986 →
Active Test Socket
Application:
11/671,963 →
Compressive Conductors for Semiconductor Testing
Application:
11/671,942 →
Prismatic Battery Having Electrolyte Injection-Hole Capable of Excellent Sealing-Disposition
Application:
11/558,951 →
Interconnect Assembly for Testing Integrated Circuit Packages
Application:
11/558,603 →
Probe Array Wafer
Application:
11/511,061 →
Probe with Contact Ring
Application:
11/510,313 →
Adjustable test socket
Application:
60/780,448 →
Crimped tube electrical test socket pin
Application:
60/765,549 →
Active test socket
Application:
60/765,555 →
Compressive conductors for semiconductor testing
Application:
60/765,710 →
Interconnect assembly for testing integrated circuit packages
Application:
60/735,939 →
Algoristic Spring as Probe
Application:
11/261,551 →
Interconnect Assembly for a Probe Card
Application:
11/198,995 →
PCT:
PCTUS2005028240 ↗
Modular Semiconductor Package Testing Contactor System
Application:
11/177,673 →
Dual Tapered Spring Probe
Application:
11/172,275 →
Eccentric Offset Kelvin Probe
Application:
11/137,187 →
Multipath Interconnect with Meandering Contact Cantilevers
Application:
11/125,035 →
See-Saw Interconnect Assembly with Dielectric Carrier Grid Providing Spring Suspension
Application:
11/077,054 →
Spring plunger probe
Application:
11/017,315 →
Multipath Interconnect with Meandering Contact Cantilevers
PCT:
PCTUS2004028200 ↗
See-Saw Interconnect Assembly with Dielectric Carrier Grid Providing Spring Suspension
PCT:
PCTUS2004028126 ↗
Spring plunger probe
Application:
60/545,882 →
See-Saw Interconnect Assembly with Dielectric Carrier Grid Providing Spring Suspension
Application:
10/759,338 →
Sheet Metal Interconnect Array
Application:
29/194,881 →
Multipath Interconnect with Meandering Contact Cantilevers
Application:
10/700,401 →
Contact Probe with Off-Centered Back-Drilled Aperture
Application:
10/266,263 →
Electrical Contact Interface
Application:
10/028,202 →
Bundled Probe Apparatus for Multiple Terminal Contacting
Application:
09/775,676 →