Patent Assignment
Reel/Frame 018587/0052
Assignment of Assignor's Interest
Recorded: 2006-11-17
Pages: 4
Assignors
KIM, KYUNGOE
Executed: 2006-11-08
KIM, YOUNGJOON
Executed: 2006-11-08
SHIN, HYUNSOO
Executed: 2006-11-08
Assignee
STATS CHIPPAC, INC.
47400 KATO RD., FREMONT, CALIFORNIA, 94538
Covered Property
(1)
Methods for Manufacturing Thermally Enhanced Flip-Chip Ball Grid Arrays
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Release of Security Interest
Jun 4, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052844/0491 →