IP Library › Assignment 018620/0724
Patent Assignment
Reel/Frame 018620/0724

Assignment of Assignor's Interest

Recorded: 2006-12-12 Pages: 3
Assignor
PENDSE, RAJENDRA D.
Executed: 2006-11-07
Assignee
STATS CHIPPAC, INC.
47400 KATO ROAD, FREMONT, CALIFORNIA, 94538
Covered Property (1)
Semiconductor Package with Embedded Die
Patent: 8,174,119 →
Application: 11/595,638 →
Publication: US 2008/0111233
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Release of Security Interest Jun 4, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052844/0491 →