IP Library › Assignment 018686/0193
Patent Assignment
Reel/Frame 018686/0193

Assignment of Assignor's Interest

Recorded: 2006-12-28 Pages: 4
Assignor
HONG, JI HO
Executed: 2006-12-26
Assignee
DONGBU ELECTRONICS CO., LTD.
891-10 DAECHI-DONG, GANGNAM-GU, SEOUL, 135-280, KOREA, REPUBLIC OF
Covered Property (1)
Copper Metal Interconnection with a Local Barrier Metal Layer
Patent: 7,589,021 →
Application: 11/616,737 →
Publication: US 2007/0173061
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger and Change of Name Nov 29, 2017
From: DONGBU ELECTRONICS CO., LTD.; DONGBU HITEK CO., LTD.
To: DONGBU HITEK CO., LTD.
Reel/Frame 044533/0523 →
Change of Name Nov 30, 2017
From: DONGBU HITEK CO., LTD.
To: DB HITEK CO., LTD
Reel/Frame 044555/0913 →
Assignment of Assignor's Interest Jul 10, 2019
From: DB HITEK CO., LTD.
To: COLUMBA TECHNOLOGIES INC.
Reel/Frame 049709/0857 →
Assignment of Assignor's Interest Jun 5, 2020
From: COLUMBA TECHNOLOGIES, INC.
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 052845/0474 →