IP Library Assignment 018698/0103
Patent Assignment
Reel/Frame 018698/0103

Assignment of Assignor's Interest

Recorded: 2006-12-08 Pages: 2
Assignor
EPPLER, BARRY W.
Executed: 2006-12-07
Assignee
VERIGY (SINGAPORE) PTE. LTD.
NO. 1 YISHUN AVE. 7, LOT 1937C 1935X, 1975P, 768923, SINGAPORE
Covered Property (1)
Interconnect Assemblies, and Methods of Forming Interconnects, Between Conductive Contact Bumps and Conductive Contact Pads
Patent: 7,452,214 →
Application: 11/636,096 →
Publication: US 2008/0136039
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 20, 2012
From: VERIGY (SINGAPORE) PTE LTD
To: ADVANTEST (SINGAPORE) PTE LTD
Reel/Frame 027896/0018 →
Assignment of Assignor's Interest Apr 6, 2015
From: ADVANTEST (SINGAPORE) PTE. LTD.
To: ADVANTEST CORPORATION
Reel/Frame 035371/0265 →
Corrective Assignment to Correct the Assignee Address Previously Recorded at Reel: 035371 Frame: 0265. Assignor(S) Hereby Confirms the Assignment. Apr 14, 2015
From: ADVANTEST (SINGAPORE) PTE. LTD.
To: ADVANTEST CORPORATION
Reel/Frame 035425/0768 →
Change of Address Dec 18, 2018
From: ADVANTEST CORPORATION
To: ADVANTEST CORPORATION
Reel/Frame 047987/0626 →