Patent Assignment
Reel/Frame 018874/0087
Assignment of Assignor's Interest
Recorded: 2007-02-01
Pages: 2
Assignee
SHOWA HIGHPOLYMER CO., LTD.
3-20, KANDA NISHIKI-CHO, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Curable Resin Composition, Molded Product, and Process for Producing the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.