IP Library Granted Patent US 7,723,445
Granted Patent B2
US 7,723,445 · App. 11/659,117 · Granted May 25, 2010

Curable resin composition, molded product, and process for producing the same

Assignee: Showa Highpolymer Co., Ltd.
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,723,445
App. No.
11/659,117
Granted
May 25, 2010
Kind
B2
Abstract

By heating, allowing to stand at normal temperature, or irradiating in the presence of a photo-polymerization initiator, a curable resin composition which contains (A) a resin material having a radical polymerizable unsaturated group and an epoxy group, (C) a radical polymerization initiator, (D) an amine compound and/or a mercaptan compound containing one or more of active hydrogen in one molecule, and (E) a compound, which is an adduct in which the (D) amine compound and/or a mercaptan compound, is reacted with the radical polymerizable unsaturated group of the (A) resin material, thereby a cured product can be obtained.

Claims (12)

1. A curable resin composition comprising:

(A) a resin material having a radical polymerizable unsaturated group and an epoxy group, (C) a radical polymerization initiator,

(D) an amine compound having one or more active hydrogen in one molecule and a mercaptan compound containing one or more of active hydrogen in one molecule, and

(E) a compound which is an adduct in which the amine compound and a mercaptan compound is reacted with the radical polymerizable unsaturated group of the (A) resin material.

2. The curable resin composition as set forth in claim 1 , further comprising (F) a tertiary amine.

3. The curable resin composition as set forth in claim 2 , wherein said (F) tertiary amine is a tertiary amine which contains a radical polymerizable unsaturated group in a molecule.

4. The curable resin composition as set forth in claim 1 , further comprising (G) a reinforcing fiber.

5. The curable resin composition as set forth in claim 1 , wherein said (A) resin material having a radical polymerizable unsaturated group and epoxy group is a resin obtained by vinyl ester group modified epoxy resin so that an equivalence ratio between the epoxy group and the radical polymerizable unsaturated group ranges from 0.95/0.05 to 0.05/0.95.

6. The curable resin composition as set forth in claim 1 , wherein said (A) resin material having a radical polymerizable unsaturated group and epoxy group is a mixture of an epoxy resin and a radical polymerizable resin so that an equivalence ratio between the epoxy group and the radical polymerizable unsaturated group ranges from 0.95/0.05 to 0.05/0.95.

7. The curable resin composition as set forth in claim 1 , wherein said (C) radical polymerization initiator is a normal temperature radical polymerization initiator consisting of an organic peroxide and a cobalt salt.

8. The curable resin composition as set forth in claim 1 , wherein said (C) radical polymerization initiator is a thermal polymerization initiator and/or a photo polymerization-initiator.

9. A molded product obtained by curing said curable resin composition as set forth in claim 1 .

Assignments (2)
MERGER Recorded Oct 8, 2010
From: SHOWA HIGHPOLYMER CO., LTD.
To: SHOWA DENKO K.K.
Reel/Frame 025111/0011 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 1, 2007
From: YAMAUCHI, SHINTARO; OTANI, KAZUO
To: SHOWA HIGHPOLYMER CO., LTD.
Reel/Frame 018874/0087 →
Priority Claims (1)
JP 2004-230502 · Aug 6, 2004 · national
Continuity (1)
Related Publication 20090008834A1 · Jan 8, 2009