Patent Assignment
Reel/Frame 025111/0011
Merger
Recorded: 2010-10-08
Pages: 6
Assignor
SHOWA HIGHPOLYMER CO., LTD.
Executed: 2010-07-01
Assignee
SHOWA DENKO K.K.
13-9, SHIBADAIMON 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Curable Resin Composition, Molded Product, and Process for Producing the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.