Patent Assignment
Reel/Frame 019467/0945
Assignment of Assignor's Interest
Recorded: 2007-06-22
Pages: 4
Assignors
OYAMA, KAZUHIRO
Executed: 2007-05-24
MORI, MITSUHIRO
Executed: 2007-05-24
SAITO, KATSUAKI
Executed: 2007-06-01
KOIKE, YOSHIHIKO
Executed: 2007-05-31
Assignee
HITACHI, LTD.
6-6 MARUNOUCHI 1-CHOME, CHIYODA-KU,, TOKYO, JAPAN
Covered Property
(1)
Power Semiconductor Module and Fabrication Method Thereof
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Original Electronic Cover Sheet, the 2ND Inventor's Name Is Misspelled and the Assignee's Address Is Incorrect, Previously Recorded on Reel 019467 Frame 0945. Assignor(S) Hereby Confirms the Assignment.
Jun 13, 2012
From: OYAMA, KAZUHIRO; MORI, MUTSUHIRO; SAITO, KATSUAKI; KOIKE, YOSHIHIKO
To: HITACHI, LTD.
Reel/Frame 028371/0941 →
Nunc Pro Tunc Assignment
Nov 17, 2022
From: HITACHI, LTD.
To: HITACHI POWER SEMICONDUCTOR DEVICE, LTD.
Reel/Frame 061806/0767 →
Change of Name
Apr 30, 2025
From: HITACHI POWER SEMICONDUCTOR DEVICE LTD.
To: MINEBEA POWER SEMICONDUCTOR DEVICE INC.
Reel/Frame 071142/0232 →