Patent Assignment
Reel/Frame 028371/0941
Corrective Assignment to Correct the Original Electronic Cover Sheet, the 2ND Inventor's Name Is Misspelled and the Assignee's Address Is Incorrect, Previously Recorded on Reel 019467 Frame 0945. Assignor(S) Hereby Confirms the Assignment.
Recorded: 2012-06-13
Pages: 10
Assignors
OYAMA, KAZUHIRO
Executed: 2007-05-24
MORI, MUTSUHIRO
Executed: 2007-05-24
SAITO, KATSUAKI
Executed: 2007-06-01
KOIKE, YOSHIHIKO
Executed: 2007-05-31
Assignee
HITACHI, LTD.
6-6, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Power Semiconductor Module and Fabrication Method Thereof
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 22, 2007
From: OYAMA, KAZUHIRO; MORI, MITSUHIRO; SAITO, KATSUAKI; KOIKE, YOSHIHIKO
To: HITACHI, LTD.
Reel/Frame 019467/0945 →
Nunc Pro Tunc Assignment
Nov 17, 2022
From: HITACHI, LTD.
To: HITACHI POWER SEMICONDUCTOR DEVICE, LTD.
Reel/Frame 061806/0767 →
Change of Name
Apr 30, 2025
From: HITACHI POWER SEMICONDUCTOR DEVICE LTD.
To: MINEBEA POWER SEMICONDUCTOR DEVICE INC.
Reel/Frame 071142/0232 →