IP Library › Assignment 061806/0767
Patent Assignment
Reel/Frame 061806/0767

Nunc Pro Tunc Assignment

Recorded: 2022-11-17 Pages: 3
Assignor
HITACHI, LTD.
Executed: 2022-10-31
Assignee
HITACHI POWER SEMICONDUCTOR DEVICE, LTD.
2-2, OMIKA-CHO 5-CHOME, HITACHI-SHI,, IBARAKI, 319-1221, JAPAN
Covered Properties (3)
Power Semiconductor Module and Fabrication Method Thereof
Patent: 8,283,763 →
Application: 11/762,276 →
Publication: US 2007/0290305
Semiconductor Device and Power Converter Using the Same
Patent: 8,120,098 →
Application: 12/537,548 →
Publication: US 2010/0039844
Power Semiconductor Module and Fabrication Method Thereof
Patent: 8,304,889 →
Application: 12/732,238 →
Publication: US 2010/0176505
Related Assignments (4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 22, 2007
From: OYAMA, KAZUHIRO; MORI, MITSUHIRO; SAITO, KATSUAKI; KOIKE, YOSHIHIKO
To: HITACHI, LTD.
Reel/Frame 019467/0945 →
Assignment of Assignor's Interest Nov 23, 2009
From: ARAI, TAIGA; MORI, MUTSUHIRO
To: HITACHI, LTD.
Reel/Frame 023555/0846 →
Corrective Assignment to Correct the Original Electronic Cover Sheet, the 2ND Inventor's Name Is Misspelled and the Assignee's Address Is Incorrect, Previously Recorded on Reel 019467 Frame 0945. Assignor(S) Hereby Confirms the Assignment. Jun 13, 2012
From: OYAMA, KAZUHIRO; MORI, MUTSUHIRO; SAITO, KATSUAKI; KOIKE, YOSHIHIKO
To: HITACHI, LTD.
Reel/Frame 028371/0941 →
Change of Name Apr 30, 2025
From: HITACHI POWER SEMICONDUCTOR DEVICE LTD.
To: MINEBEA POWER SEMICONDUCTOR DEVICE INC.
Reel/Frame 071142/0232 →