IP Library › Assignment 019474/0410
Patent Assignment
Reel/Frame 019474/0410

Assignment of Assignor's Interest

Recorded: 2007-06-25 Pages: 3
Assignors
CHENG, CHI-PIAO
Executed: 2007-06-22
LIANG, LI-CHUN
Executed: 2007-06-22
HUANG, YU-JEN
Executed: 2007-06-22
CHEN, BEEN
Executed: 2007-06-22
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property (1)
Wafer Supporting Device of a Sputtering Apparatus
Patent: 8,062,487 →
Application: 11/768,192 →
Publication: US 2008/0317564
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 20, 2008
From: TING, SHENG-YIH
To: UNITED MICROELECTRONICS CORP.
Reel/Frame 021123/0662 →
Assignment of Assignor's Interest Jul 26, 2021
From: UNITED MICROELECTRONICS CORPORATION
To: MARLIN SEMICONDUCTOR LIMITED
Reel/Frame 056991/0292 →