Wafer supporting device of a sputtering apparatus
View Patent ↗A wafer supporting device of a sputter apparatus includes a pedestal positioned in a sputtering chamber and used to load a wafer for sputtering, a deposition ring having a recess positioned on a peripheral portion of the pedestal, and a cover ring positioned on the pedestal and the deposition ring. The cover ring has a gate corresponding to the recess.
1. A wafer supporting device of a sputter apparatus comprising:
a pedestal positioned in a sputter chamber for loading a wafer for sputtering;
a deposition ring positioned on a peripheral portion of the pedestal, the deposition ring comprising a recess having a closed bottom portion and a metal film covering a portion of an upper surface of the deposition ring, the metal film not covering the recess; and
a cover ring positioned on the pedestal and the deposition ring, the cover ring comprising a gate corresponding to the recess of the deposition ring, the gate not touching the bottom portion of the recess, the gate being positioned between the deposition ring and a conjunction of the deposition ring and the cover ring and the metal film.
2. The wafer supporting device of claim 1 , wherein the pedestal comprises an electrostatic chuck (E-chuck) for attracting the wafer.
3. The wafer supporting device of claim 2 , wherein the E-chuck comprises ceramic.
4. The wafer supporting device of claim 1 , wherein the deposition ring comprises ceramic.
5. The wafer supporting device of claim 1 , wherein the metal film comprises aluminum or aluminum oxide.
6. The wafer supporting device of claim 1 , wherein the cover ring is removable.
7. The wafer supporting device of claim 1 , wherein the cover ring comprises metal material.
8. The wafer supporting device of claim 1 , wherein the cover ring and the gate are monolithically formed.
9. The wafer supporting device of claim 1 , wherein the gate has a height of 3-5 mm.
10. The wafer supporting device of claim 1 , wherein the gate of the cover ring and the recess of the deposition ring are engaged without contacting.
11. A wafer supporting device of a sputter apparatus comprising:
a pedestal positioned in a sputter chamber for loading a wafer for sputtering;
a deposition ring positioned on a peripheral portion of the pedestal, the deposition ring comprising a recess and the recess of the deposition ring having a closed bottom portion;
a metal film covering a portion of an upper surface of the deposition ring, the metal film not covering the recess; and
a cover ring positioned on the pedestal and the deposition ring and not contacted to the wafer, the cover ring comprising a gate corresponding to the recess of the deposition ring, the gate not touching the bottom portion of the recess and positioned between the deposition ring and a conjunction of the deposition ring and the cover ring.