Patent Assignment
Reel/Frame 021123/0662
Assignment of Assignor's Interest
Recorded: 2008-06-20
Pages: 4
Assignor
TING, SHENG-YIH
Executed: 2008-05-08
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Wafer Supporting Device of a Sputtering Apparatus
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 25, 2007
From: CHENG, CHI-PIAO; LIANG, LI-CHUN; HUANG, YU-JEN; CHEN, BEEN
To: UNITED MICROELECTRONICS CORP.
Reel/Frame 019474/0410 →
Assignment of Assignor's Interest
Jul 26, 2021
From: UNITED MICROELECTRONICS CORPORATION
To: MARLIN SEMICONDUCTOR LIMITED
Reel/Frame 056991/0292 →