Patent Assignment
Reel/Frame 019508/0240
Assignment of Assignor's Interest
Recorded: 2007-07-02
Pages: 9
Assignors
CHIU, CHIN-TIEN
Executed: 2007-06-15
TAKIAR, HEM
Executed: 2007-06-28
LIAO, CHIH-CHIN
Executed: 2007-06-15
YU, CHEEMEN
Executed: 2007-06-25
YE, NING
Executed: 2007-06-07
CHIEN, JACK CHANG
Executed: 2007-06-15
Assignee
SANDISK CORPORATION
601 MCCARTHY BOULEVARD, MILPITAS, CALIFORNIA, 95035
Covered Property
(1)
Method of Fabricating a Semiconductor Package Having Through Holes for Molding Back Side of Package
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.