Patent Assignment
Reel/Frame 026261/0881
Assignment of Assignor's Interest
Recorded: 2011-05-11
Pages: 6
Assignor
SANDISK CORPORATION
Executed: 2011-04-04
Assignee
SANDISK TECHNOLOGIES INC.
6900 NORTH DALLAS PARKWAY, TWO LEGACY TOWN CENTER, PLANO, TEXAS, 75024
Covered Property
(1)
Method of Fabricating a Semiconductor Package Having Through Holes for Molding Back Side of Package
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.