IP Library › Assignment 019550/0638
Patent Assignment
Reel/Frame 019550/0638

Assignment of Assignor's Interest

Recorded: 2007-07-13 Pages: 6
Assignor
Assignee
JONES FARM TECHNOLOGY, LLC
1209 ORANGE STREET, WILMINGTON, DELAWARE, 19801
Covered Properties (4)
Method and Apparatus for Evaluating a Known Good Die Using Both Wire Bond and Flip-Chip Interconnects
Patent: 6,221,682 →
Application: 09/321,565 →
Method for Testing of Known Good Die
Patent: 6,697,978 →
Application: 09/624,247 →
Method and Apparatus for Evaluating a Known Good Die Using Both Wire Bond and Flip-Chip Interconnects
Patent: 6,900,654 →
Application: 09/832,884 →
Publication: US 2001/0031508
Method for Testing of Known Good Die
Application: 60/161,418 →
Related Assignments (4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 22, 2001
From: LOCKHEED MARTIN CORPORATION
To: BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION, INC.
Reel/Frame 012287/0780 →
Merger Dec 9, 2015
From: JONES FARM TECHNOLOGY, LLC
To: RATEZE REMOTE MGMT. L.L.C.
Reel/Frame 037253/0050 →
Assignment of Assignor's Interest Mar 21, 2019
From: INTELLECTUAL VENTURES ASSETS 113 LLC
To: M-RED INC.
Reel/Frame 048661/0804 →
Assignment of Assignor's Interest Mar 22, 2019
From: RATEZE REMOTE MGMT. L.L.C.
To: INTELLECTUAL VENTURES ASSETS 113 LLC
Reel/Frame 048680/0756 →