IP Library › Assignment 019570/0508
Patent Assignment
Reel/Frame 019570/0508

Assignment of Assignor's Interest

Recorded: 2007-07-18 Pages: 3
Assignor
SUDO, GAKU
Executed: 2007-06-11
Assignee
TOSHIBA AMERICA ELECTRONIC COMPONENTS, INC.
19900 MACARTHUR BLVD., SUITE 400, IRVINE, CALIFORNIA, 92612
Covered Property (1)
Method of Forming an Soi Substrate Contact
Patent: 7,867,893 →
Application: 11/769,914 →
Publication: US 2009/0001466
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 18, 2007
From: YANG, HAINING S.; DIVAKARUNI, RAMACHANDRA; KIM, BYEONG; LEE, JUNEDONG
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 019570/0521 →
Assignment of Assignor's Interest Aug 15, 2007
From: TOSHIBA AMERICA ELECTRONIC COMPONENTS, INC.
To: KABUSHIKI KAISHA TOSHIBA
Reel/Frame 019697/0902 →