IP Library › Assignment 019697/0902
Patent Assignment
Reel/Frame 019697/0902

Assignment of Assignor's Interest

Recorded: 2007-08-15 Pages: 2
Assignor
Assignee
KABUSHIKI KAISHA TOSHIBA
1-1 SHIBAURA 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property (1)
Method of Forming an Soi Substrate Contact
Patent: 7,867,893 →
Application: 11/769,914 →
Publication: US 2009/0001466
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 18, 2007
From: SUDO, GAKU
To: TOSHIBA AMERICA ELECTRONIC COMPONENTS, INC.
Reel/Frame 019570/0508 →
Assignment of Assignor's Interest Jul 18, 2007
From: YANG, HAINING S.; DIVAKARUNI, RAMACHANDRA; KIM, BYEONG; LEE, JUNEDONG
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 019570/0521 →