IP Library › Assignment 019570/0521
Patent Assignment
Reel/Frame 019570/0521

Assignment of Assignor's Interest

Recorded: 2007-07-18 Pages: 6
Assignors
YANG, HAINING S.
Executed: 2007-07-05
DIVAKARUNI, RAMACHANDRA
Executed: 2007-07-05
KIM, BYEONG
Executed: 2007-06-05
LEE, JUNEDONG
Executed: 2007-06-12
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property (1)
Method of Forming an Soi Substrate Contact
Patent: 7,867,893 →
Application: 11/769,914 →
Publication: US 2009/0001466
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 18, 2007
From: SUDO, GAKU
To: TOSHIBA AMERICA ELECTRONIC COMPONENTS, INC.
Reel/Frame 019570/0508 →
Assignment of Assignor's Interest Aug 15, 2007
From: TOSHIBA AMERICA ELECTRONIC COMPONENTS, INC.
To: KABUSHIKI KAISHA TOSHIBA
Reel/Frame 019697/0902 →