Patent Assignment
Reel/Frame 019939/0740
Assignment of Assignor's Interest
Recorded: 2007-10-10
Pages: 5
Assignors
CURTIS, ANTHONY
Executed: 2007-02-14
BURGESS, GUY F.
Executed: 2007-02-14
JOHNSON, MICHAEL
Executed: 2007-02-14
TESSIER, TED
Executed: 2007-02-15
LU, YUAN
Executed: 2007-03-05
Assignee
FLIPCHIP INTERNATIONAL, LLC
3701 E. UNIVERSITY DRIVE, PHOENIX, ARIZONA, 85034
Covered Property
(1)
Wafer-Level Interconnect for High Mechanical Reliability Applications
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
Nov 10, 2011
From: FLIPCHIP INTERNATIONAL, LLC
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 027212/0515 →
Release of Security Interest
Feb 17, 2021
From: WELLS FARGO BANK, NATIONAL ASSOCIATION
To: FLIPCHIP INTERNATIONAL, LLC
Reel/Frame 055292/0898 →
Assignment of Assignor's Interest
Jun 17, 2021
From: FLIPCHIP INTERNATIONAL, LLC
To: HUATIAN TECHNOLOGY(KUNSHAN) ELECTRONICS CO.,LTD.
Reel/Frame 056612/0882 →