Patent Assignment
Reel/Frame 019971/0151
Assignment of Assignor's Interest
Recorded: 2007-10-16
Pages: 3
Assignor
SHIM, CHEON MAN
Executed: 2007-10-15
Assignee
DONGBU HITEK CO., LTD.
891-10 DAECHI-DONG, KANGNAM-KU, SEOUL, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Forming a Device Isolation Film of a Semiconductor Device
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Nov 30, 2017
From: DONGBU HITEK CO., LTD.
To: DB HITEK CO., LTD.
Reel/Frame 044559/0819 →
Assignment of Assignor's Interest
Jul 10, 2019
From: DB HITEK CO., LTD.
To: COLUMBA TECHNOLOGIES INC.
Reel/Frame 049709/0857 →
Assignment of Assignor's Interest
Jun 5, 2020
From: COLUMBA TECHNOLOGIES, INC.
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 052845/0474 →