Patent Assignment
Reel/Frame 020001/0662
Assignment of Assignor's Interest
Recorded: 2007-10-23
Pages: 6
Assignors
COLLINS, DAVID S.
Executed: 2007-10-09
ERTURK, METE
Executed: 2007-10-10
GORDON, EDWARD J.
Executed: 2007-10-10
GROVES, ROBERT
Executed: 2007-10-09
RASSEL, ROBERT M.
Executed: 2007-10-09
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Design Structure Incorporating Semiconductor Device Structures That Shield a Bond Pad from Electrical Noise
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 3, 2015
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: GLOBALFOUNDRIES U.S. 2 LLC
Reel/Frame 036550/0001 →
Assignment of Assignor's Interest
Oct 5, 2015
From: GLOBALFOUNDRIES U.S. 2 LLC; GLOBALFOUNDRIES U.S. INC.
To: GLOBALFOUNDRIES INC.
Reel/Frame 036779/0001 →